TY  - BOOK
AU  - Liu,Xingsheng
AU  - Zhao,Wei
AU  - Xiong,Lingling
AU  - Liu,Hui
ED  - SpringerLink (Online service)
TI  - Packaging of High Power Semiconductor Lasers
T2  - Micro- and Opto-Electronic Materials, Structures, and Systems
SN  - 9781461492634
AV  - TK1001-1841 
U1  - 621.042 23
PY  - 2015///
CY  - New York, NY
PB  - Springer New York, Imprint: Springer
KW  - Energy
KW  - Energy Systems
N1  - Introduction of High Power Semiconductor Lasers -- Overview of High Power Semiconductor Laser Packages -- Thermal Design and Management in High Power Semiconductor Laser Packaging -- Thermal Stress in High Power Semiconductor Lasers -- Optical Design and Beam Shaping in High Power Semiconductor Lasers -- Materials and Components in High Power Semiconductor Laser Packaging -- Packaging Process of High Power Semiconductor Lasers -- Testing and Characterization of High Power Semiconductor Lasers -- Failure Analysis and Reliability Assessment in High Power Semiconductor Laser Packaging -- Applications of High Power Semiconductor Lasers -- Development Trend and Challenges in High Power Semiconductor Laser Packaging
N2  - This book introduces high power semiconductor laser packaging design.  The characteristics and challenges of the design and various packaging, processing, and testing techniques are detailed by the authors.  New technologies, in particular thermal technologies, current applications, and trends in high power semiconductor laser packaging are described at length and assessed
UR  - http://dx.doi.org/10.1007/978-1-4614-9263-4
ER  -