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Packaging of High Power Semiconductor Lasers electronic resource by Xingsheng Liu, Wei Zhao, Lingling Xiong, Hui Liu.

By: Liu, Xingsheng [author.]Contributor(s): Zhao, Wei [author.] | Xiong, Lingling [author.] | Liu, Hui [author.] | SpringerLink (Online service)Material type: TextTextSeries: Micro- and Opto-Electronic Materials, Structures, and SystemsPublication details: New York, NY : Springer New York : Imprint: Springer, 2015Description: XV, 402 p. 497 illus., 386 illus. in color. online resourceContent type: text Media type: computer Carrier type: online resourceISBN: 9781461492634Subject(s): Energy | Energy Systems | Energy | Energy SystemsDDC classification: 621.042 LOC classification: TK1001-1841Online resources: Click here to access online
Contents:
Introduction of High Power Semiconductor Lasers -- Overview of High Power Semiconductor Laser Packages -- Thermal Design and Management in High Power Semiconductor Laser Packaging -- Thermal Stress in High Power Semiconductor Lasers -- Optical Design and Beam Shaping in High Power Semiconductor Lasers -- Materials and Components in High Power Semiconductor Laser Packaging -- Packaging Process of High Power Semiconductor Lasers -- Testing and Characterization of High Power Semiconductor Lasers -- Failure Analysis and Reliability Assessment in High Power Semiconductor Laser Packaging -- Applications of High Power Semiconductor Lasers -- Development Trend and Challenges in High Power Semiconductor Laser Packaging.
In: Springer eBooksSummary: This book introduces high power semiconductor laser packaging design.  The characteristics and challenges of the design and various packaging, processing, and testing techniques are detailed by the authors.  New technologies, in particular thermal technologies, current applications, and trends in high power semiconductor laser packaging are described at length and assessed.
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Introduction of High Power Semiconductor Lasers -- Overview of High Power Semiconductor Laser Packages -- Thermal Design and Management in High Power Semiconductor Laser Packaging -- Thermal Stress in High Power Semiconductor Lasers -- Optical Design and Beam Shaping in High Power Semiconductor Lasers -- Materials and Components in High Power Semiconductor Laser Packaging -- Packaging Process of High Power Semiconductor Lasers -- Testing and Characterization of High Power Semiconductor Lasers -- Failure Analysis and Reliability Assessment in High Power Semiconductor Laser Packaging -- Applications of High Power Semiconductor Lasers -- Development Trend and Challenges in High Power Semiconductor Laser Packaging.

This book introduces high power semiconductor laser packaging design.  The characteristics and challenges of the design and various packaging, processing, and testing techniques are detailed by the authors.  New technologies, in particular thermal technologies, current applications, and trends in high power semiconductor laser packaging are described at length and assessed.

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